Wi-Fi(Wireless fidelity) Module
FEATURES
- IEEE® 802.11 b/g/n 20 MHz (1x1) solution
- Single spatial stream in 2.4 GHz ISM band
- Integrated Transmit/Receive switch
- Integrated PCB antenna or u.FL micro co-ax connector for external antenna
- Superior sensitivity and range via advanced PHY signal processing
- Advanced equalization and channel estimation
- Advanced carrier and timing synchronization
- Wi-Fi® Direct (supported till firmware release 19.5.2)
- Soft-AP support
- Supports IEEE 802.11 WEP, WPA, WPA2 security
- Support Enterprise security with WPA/WPA2 (802.1X)
– EAP-TLS
– EAP-PEAPv0/1 with TLS
– EAP-TTLSv0 with MSCHAPv2
– EAP-PEAPv0/1 with MSCHAPv2
- Superior MAC throughput via hardware accelerated two-level A-MSDU/A-MPDU frame aggregation and block acknowledgment
- On-chip memory management engine to reduce host load
- SPI host interface
- Operating temperature range from -40°C to +85°C. RF performance at room temperature of 25°C with a 2-3 db change at boundary conditions
- I/O operating voltage of 2.7V to 3.6V
- Built-in 26 MHz crystal
- Integrated Flash memory for system software
- Power Save modes
– 4 μA Power-Down mode typical at 3.3V I/O
– 380 μA Doze mode with chip settings preserved (used for beacon monitoring)
– On-chip low power sleep oscillator
– Fast host wake-up from Doze mode by a pin or SPI transaction
- Fast Boot options
– On-chip boot ROM (Firmware instant boot)
– SPI flash boot
– Low-leakage on-chip memory for state variables
– Fast AP re-association (150 ms)
- On-chip Network stack to offload MCU
– Integrated Network IP stack to minimize host CPU requirements
– Network features TCP, UDP, DHCP, ARP, HTTP, TLS, and DNS
– Hardware accelerators for Wi-Fi and TLS security to improve connection time
- Hardware accelerator for IP checksum
- Hardware accelerators for OTA security
- Small footprint host driver
Image shown are just indicative